This article was originally published in the May, 2019 issue of U.S. Tech and can also be found online at US-Tech.com.
If you have a bunch of complicated boards that need rework, and you need to remove solder and adhesive, it's a time consuming and risky application. In fact, even the most experienced and technical operators can get into delicate situations when faced with repeating component and pad cleaning over and over.
Solder flux fumes generated during the soldering process can create health hazards in your workplace. Since employee health is a key responsibility of any operation, and in many countries solder fume capture is a legal requirement, many electronics manufacturing facilities are moving to benchtop or under-bench fume extraction systems.
Today Metcal was awarded the third award for the CV-5200 Connection Validation™ Soldering Station.
Recently, SMT Magazine caught up with Metcal Product Support Engineer, Robert Roush to discuss Metcal’s new patented Connection Validation Hand Soldering System. The discussion gets into how originally with the introduction of SmartHeat, Metcal allowed customers to achieve a new level of process control in their hand soldering operation and how with Connection Validation, Metcal is taking process control into greater heights.
Metcal’s CV-5200 Connection Validation™ Soldering Station provides real-time closed loop feedback on intermetallic compound formation— the world’s first. Plus, a new communication port enables process traceability and firmware upgrades.
Introducing Connection Validation™ - Metcal’s latest innovation in hand soldering! Check out the 2-min video.
Metcal will be presenting two white papers at IPC APEX 2017 in San Diego this February 14-16. Take a look at a summary of what our engineers will be presenting:
When: Wednesday, Feb. 15th, 1:30 -3:00 PM
What: Panel: S17: Rework I
Rework Challenges for Leading Edge Components BGA, QFN and LED in Today’s Fast Moving Industry
(see also below: Risk Mitigation in Hand Soldering)
Presented by Paul Wood, Metcal Advanced Product Applications Manager
The electronics assembly industry continues to face the challenges associated with BGA, QFN, and LED packages. The demand for more performance by consumers drives change, which results in greater component density. Component density on printed circuit boards continues to decrease with a corresponding increase in component complexity and reduction in pitches. Good examples of these industrial trends are smart phones, tablets and wearables.